TECHNOLOGY BEHIND MINITURIZARION

FLIP CHIP BONDING

In the pursuit of developing a more compact packaging. Technologist had turn to the Flip Chip Technology. Below is a sharing from EDS Alumi to illustrate the what Flip Chip is about.

i) Interconnect Methodology

Sample Of Chip attached with Solder Bump

Sample of attached chip on the Left and flip over unattach chip on the Right